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DLP660TEAAFYG

Part number DLP660TEAAFYG
Product classification Specialized ICs
Manufacturer Texas Instruments
Description IC DIG MICROMIRROR DEV 350CPGA
Encapsulation
Packing Tray
Quantity 1
RoHS status YES
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Price

Total price

1

$965.4900

$965.4900

10

$936.4500

$9,364.5000

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Product parameters
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TYPEDESCRIPTION
MfrTexas Instruments
Series-
PackageTray
Product StatusACTIVE
Package / Case350-BFCPGA
Mounting TypeThrough Hole
TypeDigital Micromirror Device (DMD)
Supplier Device Package350-CPGA (35x32.2)
DigiKey ProgrammableNot Verified

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